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Smooth and compact deposits were obtained at various deposition potentials and Cu2+ concentrations, with Sn contents between 1.6 - 62.4 wt.%.
Nevertheless, metallic deposits were obtained and their morphologies investigated as a function of the deposition potential and water content.
Fine-grained, highly adherent and bright copper deposits were obtained.
Zn Ni NbO2 deposits were obtained on mild steel substrate using D.C. power source.
Compact and adherent deposits were obtained, with thickness up to 4 × 10−3 cm.
EDS and XRD analysis confirm that high-purity metallic Co deposits were obtained.
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In contrast, when the electrolyte is a quaternary ammonium tetrafluoroborate, dendrite-like conducting deposits are obtained.
The results indicate, that improved deposits are obtained capable to withstand very demanding applications where high microhardness along with resistance to corrosion is a prerequisite.
High hardness of copper deposits was obtained both at low concentration of MSG and at low current density.
For values of j (DC), jon (PP) and jc (RPP) below −100 mA cm−2, Co-rich, P-containing deposits are obtained.
Contrary to this combination, nearly pure Bi deposits are obtained from the typical plating solutions containing complex agents in the other combinations.
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