Sentence examples for deposits dynamic from inspiring English sources

The most common HIMs are (Wilson et al. 2014): thickness or mass loading (tephra fall, PDC deposits, lahar deposits), dynamic pressure (PDC, lahar), flow height (lava flow, lahar), presence or absence (lava flow, gas emissions), density per unit area (ballistics), impact energy (ballistics) and concentration (gas emissions, tephra fall).

We have investigated the protective effect of SixCy and SixNy coatings deposited by dynamic ion mixing (DIM) on the oxidation resistance of a Ti6242 alloy (Ti 6Al 2Sn 4Zr 2Mo).

ZnO Al films deposited in dynamic DC mode exhibited inferior resistivity of 8 40 × 10− 4 Ω cm, which partly could be attributed to the specific design of the inline sputter system.

An innovative reactive pulse magnetron sputtering (PMS) system allowing to change the pulse mode (unipolar, bipolar or pulse packet) has been used to deposit TiO2 films at dynamic deposition rates of 8…50 nm m/min.

Five Al Al2O3 coatings were deposited by gas dynamic cold spray, using feedstocks containing 0, 10, and 50 wt.% of Al2O3 particles admixed into commercially pure Al powders.

Alumina aluminum MMC coatings were deposited by cold gas dynamic spraying onto aluminum alloy (Al 7570) substrates.

We used the code "NOAH" (NOnlinear Anelastic Hysteretic method, Bonilla 2001): This finite difference code propagates vertically incident plane SH ground motion in a soil deposit, by integrating the dynamic equation of motion at each time step.

During electro-deposition studies at dynamic condition, we were careful in maintaining oil flow rate in the laminar region to avoid erosion of the expected deposits.

A paludification index was built using static (e.g. surficial deposits and soil texture) and dynamic (e.g. moisture regime and soil organic layer thickness) stand scale factors available from forest maps.

Also, the repository software offers more detailed and dynamic insights into the deposited QDB archives via specialized and interactive web applications.

Little or no thermal component (i.e. high temperature) is introduced in the CS process; deposit formation relies mainly on dynamic compaction as particles impact the substrate.