The composite temperature and Degree of Cure (DOC) distributions were solved by incorporating resin cure kinetics into heat transfer analysis, which were used in the subsequent stress analysis to determine the cure-dependent composite responses, including cure-dependent modulus, thermal strain, and chemical shrinkage.
Cure temperatures were designed to obtain different processing windows while the overall degree of cure was equivalent, leading to laminates with average porosities in the range 0.4% and 2.9%.
Cure kinetics, therefore, is necessary to quantify the extent of chemical reaction or degree of cure for the given cure cycle.
The degree of cure, α, as determined from d.s.c.s.c
The degree of cure development is delayed for the variable property simulation, requiring a larger die length to reach a suitable degree of cure design value.
Numerical prediction was performed for the distributions of the temperature and degree of cure.
The heating power must be carefully designed to achieve a minimum degree of cure.
The real-time degree of cure for the epoxy resin was measured by a dielectrometry sensor.
The distributions of the temperature and the degree of cure were obtained.
Moreover, the effect of degree of cure on the ACF conduction establishment was investigated in a bonding process window.
