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The current device consists of a membrane sandwiched between two PEEK sheets with a microchannel (15 cm long, 200 400 mm wide, 100 mm deep) etched into each sheet.
Via structures, 0.32 and 0.26 μm in diameter and 1 μm deep, etched through SiO2 down to bare silicon, are combined with a standard etch-pit test to look for the formation of copper silicide as a function of barrier material and process conditions.
Extensive SEM work was carried out on deep etched specimens to reveal the evolution of graphite shape in Fe C Si alloys of industrial composition during early solidification and at room temperature.
A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate.
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The detailed morphology of the collagen fibrils/aggregates was examined using Quick Freeze Deep Etch (QFDE) electron microscopy.
Using deep etch and photoresist reflow method, we first designed and fabricated a silicon master for subsequent UV-embossing processes of the mirror.
An investigation of silicon deep etch by DRIE was performed and achieved a depth greater than 200 μm for 10 μm diameter channels.
The AVC actuators and latching mechanisms are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etch steps.
In the case of pre-patterned wafers no cracks appear around the features, however we observed unsatisfied development within the resist features caused by insufficient solidification in the deep etch pits during Soft Bake.
(A – E ) Selected but representative deep etch-EM replicas revealing the glass-attached ventral surface of control HeLa SS6 (A and B ) or clone #64/1.E (C – E ) cells.
The use of deep etch to score this phenotype is a really nice part of the paper, but the differences need to be made more clear.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com