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The gel stiffness S decreased as curing temperature increased or as POSS concentration increased.
The reduction rate decreased as curing time progressed.
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According to above results, the electrical resistivity decreased as UV curing time increased up to 360 s, and then decreased slightly when UV curing time was larger than 360 s.
In humid environment, although the compressive strength of HFM decreased as the curing time extended, it will gradually stabilize.
According to the flexural strength test results regarding the curing temperatures (20, 10, 0, and − 10 °C) applied in this study, the flexural strengths were notably decreased as the curing temperature is decreased as shown in Fig. 9.
A higher flow to Non-DOTS services leads to more patients partially cured, and the proportion TB death slightly decreases as well.
The electrical resistivity of silver films decreased as the UV curing time increased or the D decreased due to the efficient removal of organic substances.
In addition, the compressive strength, tensile strength and resilient modulus all increase as the cement content and curing time increase, while the ratio of compressive strength to tensile strength decreases as the curing time increases.
Also, these values decreased as MMA contents increased and curing temperatures decreased.
The cohesive intercept decreased and failure friction increased over time, while shear strength between the treated mud at 7 and 28 curing days decreased as confining pressure increased.
The experimental results demonstrate that the compressive and flexural strength at different curing ages increased as increasing RPP content initial, and decreased as the content going beyond 0.35%.
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