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Increasing the catechol content will increase the Tg and slightly decrease the thermal stability.
In this study, aluminum confinement was used to decrease the thermal expansion of LX-17.
To this end, we decrease the thermal diffusivity κ along two paths in parameter space.
As a result, the heat transfer is decreased due to atmospheric loss, which decrease the thermal efficiency.
Our findings also show that the existence of GO can obviously decrease the thermal stability of protein.
Moreover, thermal degradation analysis (TGA) shows that polyoxometalate could significantly decrease the thermal degradation temperatures of cured epoxy resins.
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Defects and buckling decreased the thermal diffusivity dramatically.
In addition, it increases the bending strength, hardness and decreases the thermal expansion coffecient.
Increasing the cooling temperature decreased the thermal resistance of plate OHPs.
In pure SiC, irradiation-induced complete amorphous SiC significantly decreased the thermal conductivity.
Inclusion of W wires further decreases the thermal stress in W-Cu functionally graded layer.
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