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The wafers were cut into samples of 2 × 2 cm2.
The panels were cut into samples, and their physical and mechanical properties determined according to ASTM D 1037-96a standard.
The as-extruded sheet was cut into samples with dimensions of 10 mm (TD) × 20 mm (ED) × 3 mm (ND).
The initial substrate was cut into samples of size 0.5 cm × 2 cm, with different strains applied on the samples.
Two mPE films of dimensions 10 cm × 10 cm were cut into samples sizes of 1 cm × 2 cm.
mPE was cut into samples of square shape with a length and breadth of 1 cm × 1 cm for the studies.
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The finished wafer is cut into sample pieces of 7.5 × 7.5 mm2; Fig. 1e shows a schematic device cross-section and bird's-eye view.
Using the piezo-actuated Z control, the operator directed the needle tip 20 30 μm past the surface of the sample to "cut" into the sample layer.
The Pt-BMG bulk alloy was cut into cylindrical samples approximately 2 mm in diameter and a height of 2 mm using a diamond saw, and the cylindrical samples were ultrasonically cleaned using acetone and isopropanol.
Commercial silicon wafer with a thickness of 0.50 mm was cut into square samples which were 10 × 10 mm2 in size.
A 250-μm-thick p-type (boron doped) Si wafer with resistivity of 1 to 10 Ωcm and (100) orientation was cut into small samples (1 × 1 cm2) and polished on one side for the fabrication of solar cells.
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