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A simple experimental technique is presented for measuring yield stress of aluminum (Al) thin film with residual stress by combining the curvature test with sphere-tip nanoindentation test.
The residual stress is measured to be 115 MPa (tensile) using curvature test, and the yield stress of Al films sputtered on the Si substrates is calculated to be 371 MPa using the new fitted equation.
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Even though our model does not show any strong curvature, we test the Head AIS variable using a quadratic term, to validate our results.
The variables measured included radial, axial, and crush deformations, as well as radii of stent curvatures during tested maneuvers.Radial deformations of the stented vessels were significantly less than axial and crush deformations, ranging from -10.2% to 15.5%.
For example, we use the "double-double" tests to test curvature at genetic distances of four, whereas standard tests allow curvature to be examined only at distances of two.
Combined with the results of a physical exam that includes a measurement of the spine's curvature, the gene test produces a number called the ScoliScore that has been shown in clinical studies to predict with almost 99 percent accuracy whether mild adolescent scoliosis in white children will progress to become a severe curve that requires surgery.
The same test curvature examples were programmed digitally and are shown alongside the physical mirror measurements in Fig. 2b.
Track curvature analysis was tested for statistical significance using Kolmogorov Smirnov two-sample test.
Both curvature and nanoindentation tests are carried out on an Al film/Si substrate system.
The residual stresses in the film deposited on a silicon substrate are evaluated based on wafer curvature whereby nanoindentations tests are applied to estimate the Young's modulus of the deposited film.
Box Cox (for slope) and arctangent (for curvature) transformations are tested on nine digital elevation models (DEMs) of varying origin and resolution, and different landscapes, and shown to be effective.
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