Sentence examples for cu contact from inspiring English sources

Exact(2)

For the SLG suspended on SiO2, adding Cu contact at ends can remarkably improve the heat dissipation and lower the maximum temperature in SLG, especially at small lengths of SLG.

For the SLG fully supported on SiO2, adding Cu contact can effectively lower the temperature in SLG of small length, but the dominating heat dissipation pathway will be shifted from SLG/Cu interface to SLG/SiO2 interface as the SLG length increases.

Similar(58)

Malec, C. E., Elkus, B. & Davidović, D. Vacuum-annealed Cu contacts for graphene electronics.

A hybrid Boltzmann transport equation model coupled with a two-temperature model is developed to simulate the heat dissipation in single layer graphene (SLG) suspended or supported on SiO2 and with/without Cu contacts.

The selection rate is around 15%, which is similar as that of pyridyl-Cu contact in an acidic solution in our previously report [28].

Aspects of back contacting CdTe/CdS devices, including etching, Cu application, contact annealing, back contact chemistry and secondary contacts, are discussed.

Since the pyridyl group also has received much attention [15, 17, 25 27], we recently extended this approach to the conductance measurement of pyridyl-based molecules binding to Cu electrode, which shows that the single-molecule conductance with pyridyl-Cu contacts is smaller than that with pyridyl-Au contacts [28].

All the integration steps for CNT integration, for patterning the Cu top contact and the mask-set used are compatible with 130 nm device technologies on 200 mm wafers.

If you have questions about the function and uses of CU-Soil™, contact Nina Bassuk: [email protected]

Similarly, the Cu-TiO2 contact in the present work might lengthen the lifetime of electron hole pair separation and allow enough time for electrons to migrate into the metal and transport through the copper bridge.

The enhanced antibacterial properties resulted from the superhydrophilic behavior of the Cu-dotted surface that allowed bacteria to contact Cu more effectively due to spreading of the bacterial suspension media.

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