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X-ray photo electron spectroscopy (XPS) results of the coatings after oxidation showed improved oxidation resistance of composite coatings as compared to the pure Cu coating.
Although both the coatings have relatively low porosity of ~ 0.5%, GA Cu coating presents a much higher in-plane electrical conductivity of 73% of IACS, but a poorer corrosion resistance than E Cu coating.
Composite coatings unexpectedly exhibited poor wear performance when compared with that of unreinforced Cu coating.
Gao, J. et al. Suppression of PC decomposition at the surface of graphitic carbon by Cu coating.
The morphology of Cu coating changes from cauliflower-like structure to angular shape with increase in bath temperature and pH.
The Cu coating was too thin and showed poorly coated areas.
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Open image in new window Figure 8 XRD pattern of Ni-P-Cu coating.
The electroless ternary Ni-P-Cu coating has been developed on mild steel substrate by varying four input design parameters, namely concentration of nickel source (nickel sulphate), concentration of reducing agent (sodium hypophosphite), concentration of copper source (copper sulphate) and post-deposition heat treatment temperature.
The friction coefficient of the coatings has an increasing trend by sequence of the Cu-Sn coating, Cu-Sn/Co-base coating, and Cu-Sn/Co-base/Mo coating, but an obvious difference could not be seen in the coatings.
The results are compared with those for a similar electrode without the Cu-coating.
In this research, an electroplating mean was carried to obtain a Cu-coating on the Mg Li alloy.
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