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Furthermore, Cu atomic point-defect scattering play an important role in reducing the lattice thermal conductivity.
The Cu atomic content of Ti Cu N films was determined by Electron Probe Micro-Analyzer (EPMA).
Therefore, the notable contrast in the Cu atomic and electronic structures between the crystalline and amorphous phases results in an obvious phase transition barrier for high-temperature storage.
As a consequence, coarsening of Cu atomic clusters also starts prior to crystallization, resulting in a reduction of available nucleation sites during Fe Si nanocrystallization.
For the efficient and stable electrochemical reduction of carbon dioxide (CO2), we fabricated bimetallic catalysts composed of palladium (Pd) nanoparticles covered with copper (Cu) atomic layers.
They are referred to as Pt3Fe/C, PtFe/C and Pt5.75Fe5.75Cu/C catalysts and the subscripts refer to the nominal Pt, Fe and Cu atomic ratios.
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The high-angle annular dark field scanning transmission electron micrograph (HAADF-STEM) of particles in Fig. 1d shows a strong contrast between bright and dark regions, which arises from the Z-contrast of different atomic nuclei: Cu atoms appear brighter than Al due to their higher atomic number.
Owing to smaller atomic radius of Cu atom (0.12 nm) than Ag atom (0.1445 nm), only when Cu atoms have solute into Ag cell and form Ag-Cu alloy the shrinkage of d-spacing is reasonable.
At this stage, fracture occurs by atomic rearrangement: some Cu atoms are attracted to fill in the vacancy sites of stepped surface of Ni tip while other Cu atoms fall back to the substrate.
We report on the crystal structure of these compounds which show a statistical occupation of Cu-atomic sites.
For Ni and Cu, the atomic interactions are described by the embedded-atom method (EAM) potential given by Oh and Johnson [14] and the potential developed by Rosato, Guillopé, and Legrand (RGL) on the basis of the second-moment approximation to the tight-binding model [15, 16], respectively.
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