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The solution procedure of present IB-LBM is exactly the same as the conventional IB-LBM except that the non-slip boundary condition can be satisfied in the present model while it is only approximately satisfied in the conventional model.
This condition can be satisfied by the support lemma.
The first condition can be satisfied if G(x 0+Δ) is sufficiently negative.
This condition can be satisfied at high carrier densities (typically, at least above 1016 cm−3).
As we will demonstrate, the latter condition can be satisfied with substantially fewer measurements.
It is proposed that condition can be satisfied with micro-scale electron optical elements fabricated by using MEMS technology.
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Therefore, arbitrary boundary conditions can be satisfied.
It is not clear how these conditions can be satisfied.
The interelement C1 weak-continuity conditions can be satisfied.
The following example shows that conditions can be satisfied.
(1.4) These conditions can be satisfied for suitable small meshsize, see, e.g., in [6, 7, 9].
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