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Compounds Layers of TiAl3 and TiAl2 were generated via potentiostatic electrolysis.
Phase composition and orientation of intermetallic compounds layers determine the functional and mechanical properties of solder joints.
Three compounds layers, (Ni,Co 3Sn4, (Ni,Co 3P and (Ni,Co 12P5, are formed at the reaction interface.
The results indicated that the hardness and the corrosion resistance of the AZ91D Mg alloy were greatly improved due to the formation of the continuous intermetallic compounds layers.
Furthermore, the continuous intermetallic compounds layers exhibited passive behavior and no appreciable hydrogen evolved during immersion in 3.5% NaCl solution for 72 h.
The adhesive strength of the coating was improved by filling cracks and pores of the Ti compounds layers with the Al phase to form a dense microstructure, and also by hardening the Ti compounds and Al phase with the oxygen and nitrogen contained in the coating.
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It is found that a new nanoscale AuCu super-structure formed in the interfacial intermetallic compounds layer, which is coherent with the [001] Cu substrate.
The compound layers are made up of Fe3O4 oxide layer, Fe2 3N compound layer and Fe4N diffusion layer.
As a result, processors, compilers, device drivers, operating systems, and numerous other critical components have evolved compounding layers of complex optimizations that introduce security risks.
Best results are achieved by significantly reducing the intermetallic compound layers.
XRD analysis indicated that the compound layers produced by different processes included ɛ and γ′ phases.
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