Sentence examples for component under bump from inspiring English sources

This paper discusses reliability-based design optimization (RBDO) of an automotive knuckle component under bump and brake loading conditions.

Typical 1st level reliability problems within Wafer Level Packages are cracking of repassivation materials, fatigue of bond over active pads, and cracks within the Under Bump Metalisation.

The PI outgassing substances re-deposit on the Al bump pad, increasing the resistance of interface between under-bump metallurgy (UBM) and underneath Al pad.

In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry.

Lead-free solder bumps require an increase in knowledge in the field of under bump metallization (UBM) and the interaction of bump and substrate metallization, the formation and growth of intermetallic compounds (IMCs) during liquid- and solid-phase reactions.

TSV, through silicon via; UBM, under bump metallization.

However, the formation of excessively brittle intermetallic compound (IMC) between under bump metallurgy (UBM)/solder bump interface influences the strength of solder bumps within flip chips, and may create a package reliability issue.

The feasibility of using electroplated Ni xZn films was evaluated for a new application as the under bump metallization.

Further tests were conducted using the excitations generated from a quarter-car model under bump and random road profiles.

Three distinctive layers, Ni3Sn4, NiSnP and Ni3P, were found between the Sn-containing solders and Ni P under bump metallization.

Shear tests on SnAg solder bumps were performed with a reduced height to the surface for a high shear force on the under bump metallurgy (UBM) to redistribution layer (RDL) copper interface.