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Besides saving a considerable amount of energy, achieving greater rates of heat transfer can lead to the development of more compact heat transfer systems with higher thermal efficiencies.
A performance assessment method for compact heat transfer surfaces is proposed, consisting of sizing a cross flow heat exchanger for given fluids, temperature and flow rate values.
The objective of this study is to evaluate the use of several analytical compact heat transfer models for thermal design, optimization, and performance evaluation in electronic packaging.
As energy transport processes are integrated in most industrial areas, the development of more efficient and compact heat transfer equipment has focused a lot of attention during the last decades.
The reduced coolant use, combined with the gravity-independent character of this technique, offer a new paradigm for compact heat transfer devices designed to operate in reduced- or zero-gravity environments.
Compact heat transfer devices, such as micro-heat exchangers and evaporators, are extensively used for both cooling as well as heating processes over conventional heat exchangers, such as microelectronic circuits, automobile and aerospace industries, due to high surface area to volume ratio and heat transfer rates, compactness and easy thermal control.
Similar(53)
The present work will be helpful to develop more compact, higher heat transfer efficiency, lower fan power and quieter heat exchanger of refrigeration and air condition system.
Results indicate that the materials are suitable for use in ultra-light weight heat exchanger applications such as vehicle radiators or other areas where light weight, compact, conformable heat transfer devices are needed.
The article presents experimental studies on a compact heat exchanger with heat transfer intensification by means of impinging microjets.
This provides promising ways for engineers to develop highly compact and effective heat transfer equipments.
Micro-channel heat exchangers offer potential for a highly compact solution in heat transfer applications that have space limitations.
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