Sentence examples for cmp performance from inspiring English sources
CMP performance with respect to the inhibitor concentration in the slurry is evaluated in terms of surface roughness, polishing uniformity and dishing values.
This study reports on the effects of potassium sorbate (K[CH3(CH)4Con]) on copper chemical mechanical planarization (CMP) performance and demonstrates how the performance can be controlled by the inhibitor concentration in the slurry.
For this purpose, the specific role of each chemical constituent in the slurry was elucidated at a fundamental level by electrochemical studies, X-ray photon spectroscopy (XPS) and contact angle measurements, all linked to the CMP performance on blanket wafers.
In this study, the effect of slurry aging on CMP performance was investigated systematically for regular silica based slurry as well as for slurry containing an organic biocide additive to prevent bacteria formation.
Furthermore, the impact of short time slurry aging (conditioning) on particle properties of the slurries containing polymeric additives and the adverse affects of extreme stability in the slurries containing surfactants are also discussed in terms of the two other factors that can cause variability in CMP slurry performance.
Although CMP's performance was disappointing in our original benchmark using a set of nine oligogenic diseases with Mendelian inheritance [ 12], it produced a surprising number of statistically significant results when confronted with the GWAS data on seven complex diseases [ 9].
Similarly, this combined administration of subthreshold doses of two novel selective 5-HT6 antagonists, compounds CMP X and CMP Y, with the acetylcholinesterase inhibitor donepezil (Aricept®; Eisai, Tokyo, Japan) (approved for symptomatic treatment of AD) enhanced memory performance in young Wistar rats with cognitive deficits induced by scopolamine [ 40].
In addition, we present several scenarios that result in excessive thermal stress to the CMP chip or significant performance loss.
Five different abrasive systems were tested in the oxide CMP processes, and their performances were evaluated in terms of material removal rate (MRR) and surface roughness.
Results highlight the satisfactory performance of the CMP method with air-coupled antennas.
When analysing the performance by individual CMP, we either insisted on a valid analysis of the cause, or were satisfied when an appropriate solution was proposed regardless whether a valid cause had been identified.
