Each sample has been finally cleaned by oxygen plasma.
For optical transmission and reflection measurements, one side of the substrate was cleaned by oxygen plasma.
The surface properties of the bond pads of gold pattern-plated (GPP) substrates cleaned by oxygen plasmas dependent on the wire bondability with gold wires are investigated.
When the outgassing characteristics of the MgO layer cleaned by the plasmas were measured in a vacuum from room temperature to 673 K by a quadrupole mass spectrometer, a decrease in vapor pressures from the outgassing species such as H2O, CO2, CO and H2 could be observed due to the removal of the contamination such as H2O and organic materials from the MgO surface by the plasma cleanings.
SPR-gold wafers (Ssens, Hengelo, Netherlands) were cleaned by UV/ozone treatment (Plasma Prep2, Gala, Gabler Labor Instruments, Germany).
Substrates were cleaned by solvent cleaning, drying, and oxygen plasma treatment.
Then 5 μL sample was applied to 400 mesh copper grids coated with continuous carbon film, which had been plasma cleaned by glow charge, and negative-stained with 1% uranyl acetate.
Briefly, glass coverslips were cleaned by use of oxygen plasma before it was placed in a vacuum desiccator containing a small drop of 1H,1H,2H,2H-perfluorooctyltrichlorosilane 1H,1H,2H,2H-perfluorooctyltrichlorosilane
For this, Si substrate was first cleaned by 5 min ultrasonication in IPA followed by 10 min oxygen plasma treatment using Plasma treatment System (Dinear, Germany).
