Sentence examples for circuit package from inspiring English sources

The purpose of the integrated circuit package is to contain the silicon device and to connect it to the external electric circuitry.

After completing it in 1956, he promoted local dances and fronted a skiffle group, whose chief attempt to escape parochial bookings was Carter insinuating his way backstage when a "scream circuit" package tour, headlined by Marty Wilde, reached the Liverpool Empire.

This condition prevents the objective achievement of a three-dimensional integrated circuit package.

Since the 80s it is known that Terrestrial Cosmic Rays, mainly reported as Atmospheric Neutrons, can penetrate the natural shielding of buildings, equipments and circuit package and induce Soft Errors in integrated circuits and breakdown of power devices.

Japanese companies have a similar grip on, for example, bonding material for integrated circuit packages and the lithography machines (called steppers) to make LCD panels.

Anisotropic microstructure is becoming a critical issue in microbumps used in 3-D integrated circuit packaging.

Polymeric composite based underfill materials, with well-controlled coefficient of thermal expansion (CTE) are critical to flip-chip and other advanced high-density integrated circuit packaging technologies.

The findings of this work are relevant to the modeling and design of practical micro-fluidic systems for targeted hot-spot cooling in future integrated circuit packaging.

Solid liquid inter-diffusion is a bonding technology that has been proposed at microscale for fabrication of ultrafine interconnects in high density and 3 dimensional integrated circuit packages.

In this study, a novel piezoresistive pressure sensor, using flip chip and flex circuit packaging technologies with spacer, is employed to substitute the conventional chip on board or small outline package (SOP) packaging technology.

Pisano and Shih provide a long list of industries that have left the U.S. entirely: compact fluorescent lighting; LCDs for monitors, TVs and handheld devices like mobile phones; crystalline and polycrystalline silicon solar cells, inverters and power semiconductors for solar panels; advanced composites, ceramics and integrated circuit packaging.