Sentence examples for capability filling from inspiring English sources

Exact(1)

But it will still be a significant new additional capability, filling the carrier gap left by the current government's 2010 review.

Similar(59)

Buncefield used to be the fifth largest oil depot in the UK with pipelines to Humberside and Merseyside plus the capability of filling 400 tanker trucks a day.

The viscosity is an indication of SSM capability in filling the mould and determines the required force for its deformation and flow.

Self-consolidating concrete is characterized by its high deformability or its capability of filling all the spaces without external forces, maintaining the stability, without segregation or blocking.

In general, chemical grouting materials are made of polymers with low viscosity, good grouting performance, high permeability, capability to fill in micro-cracks or pores.

Implementation of the existing statistical theory for capability assessment fills the gap between the theoretical development and the in-plant applications.

The current "minority" groups have been affected by unequal distribution of educational resources and achievement, leaving large gaps in the available workforce with the capability to fill highly technical and health-related jobs.

Filling capability gaps involves more time, effort, and expense the larger the "distance" that separates the desired capability from what the firm is currently doing in technological, marketing, and business model terms (Teece forthcoming).

But, the CVD was more appropriate for crack healing, likely due to its excellent crack line filling capability with a high density and high aspect ratio.

Although H2SO4 could enhance the inhibiting strength of TNBT, it also decreased the filling capability of the copper plating solution; Na2SO4 and K2SO4 did not enhance the inhibiting strength of TNBT but they increased the filling capability of the copper plating solution.

Later, more detailed studies about ALD W using SiH4 or B2H6 have been performed in terms of trench filling capability, threshold voltage vulnerability, and film adhesion during chemical mechanical polishing (CMP) [14 16].

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