The obtained films were characterized by various techniques including XRD, XPS, SEM, HRTEM and nano-indentation.
The samples were characterized by various techniques including N2 adsorption, XRD and TEM.
Functionalization was confirmed by various techniques including FTIR, Raman and TGA analysis.
The UTCB heterojunctions were characterized by various techniques including XRD, TEM, AFM, BET measurements, UV vis spectrometry, and XPS.
The properties of the films were evaluated by various techniques, including X-ray diffraction (XRD), scratch adhesion test, ball-and-crater method and atomic force microscopy (AFM).
The samples were characterized by various techniques including Vicker's hardness, X-ray diffraction, scanning electron microscopy, scratch testing and fracture toughness, with the results being presented.
Oxide films were characterized by performing various techniques, including electrochemical impedance spectroscopy, scanning electron microscopy, Raman spectroscopy, ellipsometry and diffuse reflectance FT-IR spectroscopy.
The crosslinking of poly N-vinylcarbazole) poly N-vinylcarbazole irradiation (λ > 300 nm) was studied by combining various techniques including infrared sPVKtresultingsize exclusion chromatography (SEC), difromential scanning calorimetry (DSC), swelling ratio, positron annihilation spectroscopy (PAS) and thermoporosimetry.
The phase behavior and structures of the polyethers have been investigated by combining various techniques including differential scanning calorimetry (DSC), wide angle X-ray diffraction (WAXD), small angle X-ray scattering (SAXS) and polarized light microscopy (PLM).
The particle characteristics (shape, size, distribution) are then characterized by using various techniques, including scanning electron microscopy (SEM), FT-IR spectrum analysis, and thermalgravity analysis (TGA).
The particle characteristics (e.g., shape, size, and distribution) and chemical stability were then characterized by using various techniques, including scanning electron microscopy (SEM), FT-IR spectrum analysis, and thermalgravity analysis (TGA).
