In our study design, we took maximal care to minimize the potential confound of stress by using low-stress, unreinforced behavioral tasks and gentle handling procedure to keep rats awake.
Thermal stress can be reduced significantly by using low growth temperatures.
Also, reducing heat production of bird to face excessive surrounding heat during heat stress condition by using low-quality diet (wheat) was reported, leading to non-significant reduction in body weight, body weight gain (Laudadio et al., 2012), and feed conversion ratio (Kamraa et al., 2008).
The study showed that by using a low stress stunning system it is possible to decrease drip loss, possibly by increasing the concentration of creatine phosphate and thereby delaying the acceleration of pH fall in muscles after death.
Initially, a low-stress SiN x layer was deposited on the wafer using low pressure chemical vapor deposition.
Serum cortisol levels, physiological parameters and behavior were used to assess stress experienced by cats examined using equivalent low stress handling techniques in two different environments: their home and an idealized veterinary clinic setting.
The main goal was to optimize the optical component packaging by using this low induced-stress soldering technique.
Interlaminar stresses are evaluated by using stress equilibrium equations.
We created a physiological state of oxidative stress by using a low-dose exposure to glucose oxidase.
It is thus apparent that the device thermal stability of conventional PCDTBT PCBM devices can be enhanced by an order of magnitude by using a low percentage of (PCB 2C2, at least under the thermal stress conditions and time scale studied herein.
