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A reticulated mesh like structure suitable for embedding is achieved by optimizing the deposition parameters.
The power conversion efficiency of about 4.68% has been achieved by optimizing the deposition time of Cu2S.
Stoichiometric and highly adherent films were obtained by optimizing the deposition parameters such as pulse duration, deposition and dissolution potentials.
By optimizing the deposition parameters, DLC films with hardness up to 28 GPa and friction coefficients lower than 0.15 against the 100Cr6 steel ball were obtained.
By optimizing the deposition parameters and post-etching process, a turn-on electric field of 7.08 V/μm was achieved for the DLC thin film.
The stress distribution can be altered, and the adhesion of the film/substrate can be improved by optimizing the deposition parameters.
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Here, we demonstrate that the contact resistance in bottom-contact OFETs can be significantly reduced by optimizing the metal deposition rate in conjunction with using a SAM treatment.
By optimizing the Au deposition, effective plasmonic nanostructures could be obtained with a gap spacing of <10 nm.
This characterization of the Co deposition process by FFT-IS will help in optimizing the deposition parameters such as temperature, deposition current, electrolyte composition, etc. with respect to the crystal orientation and thus also of the magnetic properties necessary for the application in magnetoelectric 1– 3 composites.
The question we wish to address is which of these factors is the most important for optimizing the deposition of plasmonic metallic films.
By optimizing the p-layer deposition and with the use of post-deposition annealing of the entire cell structure, an efficiency of 8.7% was achieved for a 1.55 eV band gap protocrystalline SiGe:H n i p cell on an Asahi U-type substrate coated with a Ag/ZnO back reflector.
More suggestions(15)
by optimizing the geometry
by optimizing the angle
by optimizing the estimation
by optimizing the stream
by optimizing the parameter
by optimizing the efficiency
by optimizing the film
by optimizing the sulfur
by optimizing the alkaline
by optimizing the growth
by optimizing the pH
by optimizing the operating
by optimizing the temperature
by optimizing the gain
by optimizing the insertion
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