The current 3D molding process time is limited by curing of PDMS to form an intermediate stamp.
The kanamycin-resistance gene was subsequently eliminated by using the temperature-sensitive helper plasmid pCP20 encoding the flippase (FLP), followed by curing of the temperature sensitive plasmids by culturing strains at 42 °C for 16 h.
This approach, even in the presence of relatively low amounts of macromonomers of ∼35 45%, provides sol-free products and up to ∼40% less polymerization shrinkage than that by curing of MMA with a conventional low molecular weight bifunctional methacrylate.
By curing of TGPS, Epon 828 and DER 732, with 4,4-diaminodiphenyl methane (DDM), the curing rate and conversion efficiency of these epoxy resins are in the order of TGPS>Epon 828>DER 732.
The dissimilar kinetics of these two systems were leveraged in the design of a sequential curing protocol in which the DCPD was first cured in the presence of the epoxy resin components, followed by curing of the epoxy resin at an elevated temperature.
Macroporous polymers were prepared by mechanically frothing a bio-based epoxy resin and hardener mixture to first create air-in-resin liquid foams, followed by curing of these liquid foams.
By curing of in water dispersed droplets of an aromatic or aliphatic epoxy resin, respectively, glassy or rubbery thermosetting epoxy spheres can be prepared in a relatively easy way.
This strain was derived from B. thuringiensis HD73 by curing of its crystal toxin bearing plasmid, pHT73 [ 12, 21].
In addition, the procedure could be used to check the homogeneity of the integration defect of potentially interesting clones by curing them of the replicative form of RS1 and subjecting them to a second round of conjugation.
Therapeutic efficacy was assessed by the cure of VAP at the end of colistin therapy (day 14).
