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Bulk micromachining is further divided into two major classes: wet bulk micromachining and dry bulk micromachining.
In wet bulk micromachining, the etching characteristics are orientation dependent.
The device has been fabricated with silicon bulk micromachining technologies.
Bulk micromachining is further divided into two categories: dry and wet etching.
There are two kinds of micromachining methods namely surface micromachining and bulk micromachining [17, 19].
Bulk micromachining and FIB milling were used to fabricate the stencil masks on a 4-in.
The scanning mirror with vertical comb drive has been successfully realized using the bulk micromachining technologies.
An improved fabrication process using surface and bulk micromachining techniques is also described.
A very simple, single metal, front-side silicon bulk micromachining fabrication technology was conceived and proposed.
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The proposed energy harvester was fabricated using a multi-layered polyimide/PZT cantilever and bulk-micromachining.
The flexible cantilever was formed using bulk-micromachining on a silicon wafer to integrate it with ICs.
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