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Therefore, Si nanostructures and a PDMS buffer layer with a rough surface can dramatically improve the AR properties of a Si surface (Figure 7).
In particular, in the case of a buffer layer with a thickness of 250 μm, the resistance was almost zero up to a curvature of 1 cm−1.
X-ray diffraction measurements revealed an epitaxial growth of the CYO buffer layer with a texture spread down to 2.2° and 4.7° for the out-of-plane and in-plane alignment, respectively.
In order to accommodate lattice strain and interface mismatch, a low-temperature ZnO buffer layer with a thickness above the critical thickness for strain relaxation is deposited on the GaN surface.
The CNTs prepared on an Au buffer layer with a thickness exceeding 40 nm were more uniform and abundant compared to those grown on substrates without a buffer layer or with a 20-nm Au buffer layer.
The growth was initiated from the GaAs buffer layer with a thickness of 200 nm at 650°C, and then temperature was reduced to 550°C for the growth of self-assembled In x Ga1 − xAs QDs.
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Buffer layers with a 20-nm low temperature AlN nucleation layer, a 1-μm high temperature AlN layer, and a graded composition AlGaN layer have been used for initial growth on sapphire.
Thin GaN buffer layers, with a thickness of 50 nm, were grown under the optimized conditions with the substrate temperature at 760 °C and Ga source temperature at 1020 °C on c-plane sapphire [11, 12].
We compared directly the nucleation sites of Ge quantum dots on a relaxed SiGe buffer layer with the sites of a minimum stored energy density of the Ge dots.
As the potential barrier at the AZO/p interface is due to the work function difference, it is possible to insert a suitable buffer layer, with higher conductivity, between the AZO and p-type a-SiC H in order to reduce the loss in the FF.
In a typical preparation procedure, a Ti buffer layer with thickness of 50 nm was deposited on the silicon substrate.
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