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In order to get the minimum mode loss and the minimum switching voltage, the parameters of the waveguide and electrode are optimized, such as the core with, core thickness, buffer layer between the core and the electrode, coupling gap between the waveguides, electrode thickness, electrode width and electrode gap.
Likewise, buffer layer between the used n-type layer and the protective one such as i-ZnO and AZO layers have also been considered to facilitate high efficient photocathode design adaptable for new solar refinery applications for water splitting or CO2 photoreduction.
The micro-heaters were fabricated with Pt-RTD on the same substrate via the MgO buffer layer between the Pt thin-film and SiO2 layer.
A silicon-based undercoat layer, which has an organic/inorganic hybrid structure, was used as an interfacial buffer layer between the organic PES and inorganic SiOxNy layer.
The hole injection efficiency was improved tremendously by inserting an ultrathin sol gel titanium oxide buffer layer between the ITO anode and hole transport layer.
The implanted substrate functioned as a buffer layer between the deposited TiN and the tool steel substrate, resulting in variations of the residual stress.
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However, few reports mentioned AlN buffer layers between ZnO and Si.
What makes this possible is the addition of buffer layers between the semiconductor layers.
A significant reduction of the leakage current down to ∼10 patcm2 at reverse bias of 1 V has been achieved by the introduction of ∼2 nm graded and ∼4 nm a-SiC H buffer la-SiC Hetween the i- and p-layers.
Monodisperse, indium doped zinc oxide (IZO) nanoparticles were prepared via the polyol-mediated synthesis and incorporated into regular and inverted poly- 3-hexylthiophene-2,5-diyl) and [6,6]-poly- 3-hexylthiophene-2,5-diylester organic poly- 3-hexylthiophene-2,5-diyllayers between the active layer and the cathode.
We did not use any buffer layers between the n-type electrode porous TiO2 and the selenium photoabsorber layer, or any additional hole-conducting layer.
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