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The driving force for grain boundary diffusion is the normal stress acting on the grain boundary.
The experimental results suggest that the Cu flux through grain boundary diffusion is the dominant mechanism for Cu6Sn5 intermetallic compound growth in Pure Sn and Sn-1Ag solders.
Because diffusion creep (grain boundary diffusion) is the dominant deformation mechanism in high-temperature regions (Fig. 1b) equivalent to deeper Martian conditions, it does not influence the rheological structure in the present study.
When grain boundary diffusion is the dominant transport mechanism of sintering, the viscous shear modulus and viscous Poisson's ratios are dependent on the grain boundary diffusion coefficient and the microscopic viscosity of grain boundary sliding.
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The results show that grain-boundary diffusion is the dominant neck-growth mechanism at relatively low sintering temperature for a long dwelling time, while surface diffusion is the dominant neck-growth mechanism at relatively high sintering temperature for a short dwelling time.
For low angle boundaries, the grain boundary diffusion is dominated by the dislocation pipe mechanism, in which the activation energy Q′ is independent of θ and the pre-exponential factor (sD′δ 0 varies linearly with sin(θ/2).
An extension of the Fisher model of grain boundary diffusion is suggested, in which the diffusion along the short-circuit paths in the bulk of the crystalline grains (dislocations, subgrain boundaries, interphase boundaries in the lamellar structures) is taken into account.
While the growth of these voids by grain boundary diffusion is well established, the mode of void nucleation is uncertain.
Furthermore, the factor 1.28 in the above equation is about eight times that of volume diffusion, showing that the influence of the magnetic transformation on the grain boundary diffusion is much larger than that on the volume diffusion.
system, confirming that grain boundary diffusion is strongly affected by the boundary structure and associated energies.
Although the volume diffusion has been found to be the dominant sintering mechanism, a significant contribution from grain boundary diffusion is also identified.
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