The void formation-and-propagation failure mechanism was observed in situ.
However, below Tg, tilt, slippage and fragmentation of the lamellae occur in both phases, which are accompanied by apparent void formation and directly lead to catastrophic fracture.
At higher temperatures, both Sn and Cu electromigration flux are important, and consequently void formation and metallization consumption operate simultaneously.
Critical parameters affecting the void formation and the final pore size have been identified and modeled.
The application of phase-field modeling to void formation and growth under irradiation is analyzed.
Our calculations suggest that both Si and Ge vacancies are more mobile in the bulk states than SL structure, which may result in void formation and even volume swelling.
Under the OM minimal void formation and relatively homogeneous surface relief is observed indicating that material removal takes place on the basis of the "layer-to-layer" ablation model and the whole structure (gypsum-charcoal) is gradually removed.
As such, many investigations were conducted to understand the void formation and growth processes (Olander, 1976; Was, 2017; Brailsford & Bullough, 1972; Krishan, 1982; Dubinko et al., 1989; El-Azab et al., 2014; Hochrainer & El-Azab, 2015; Millet & Tonks, 2011a).
In vacuum, the increase of dwell time may signify creep deformation, but does not change the mechanism which is controlled by the void formation and growth at grain boundaries, the cause of intergranular cracking.
The origin of cracking along the shear band contours in the micro indented ribbon is ascribed to void formation, and is hypothesized to be due to the generation of tensile and compressive stresses at atomic scale in shear band.
