Exact(3)
With these process innovations filling of microchannels can be prevented, non-bonded area is minimized and bonding yields are 90% for large-area microfluidic chips.
The combination of MePEG and ε-CL by covalent bonding yields diblock copolymers with bulk microstructure containing MePEG hydrophilic part isolated from PCL hydrophobic part.
With the key improvements such as fabrication process optimization, gridding channel design and HF steam treatment, the glass-based chips could be obtained with fast, easy and high bonding yields (>90%).
Similar(57)
Italian bond yields rise.
Bond yields rose.
Bond yields actually fell.
Bond yields rose slightly.
Bond yields have risen.
Bond yields fell.
Bond yields were marginally lower.
This should lower bond yields.
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