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Exact(17)
The high impact kinetic energy deforms the particles, which creates effective bonding to the substrate.
The epoxy was chosen for low viscosity and strong bonding to the substrate.
The nanoscale lubrication properties of graphene depend on chemical functionalization, adsorbants, and bonding to the substrate.
The catalyst body provides a fairly inert and mechanically robust porous microstructure onto which a catalyst metal can be thinly dispersed and fixed in position by chemical bonding to the substrate.
Crack-free coatings with metallurgical bonding to the substrate are obtained using 0.6 mm initial powder thickness.
In this case, the clad is continuous, homogeneous, with few defects and metallurgical bonding to the substrate.
Similar(43)
Results showed that the coatings can be obtained with the features of good metallurgical bonding to the substrates, and there are two phases in the composite coating: TiC and FeAl intermetallic.
Subsequently, the deposited calcium orthophosphate coatings, layers or films might be heat treated in water steam at 125°C (Shirkhanzadeh 1993) and/or then calcined at temperatures up to 800°C to densify and improve its bonding to the substrates.
One particular advantage that polymer brushes have over spin-coated polymer layers is their stability against solvents or harsh conditions (e.g., high temperatures), resulting from their covalent bonding to the substrates.
The SMMC layer is well bonded to the substrate, and the interface is crack free.
Results showed that the W-Mo coating was well diffusely bonded to the substrate.
More suggestions(20)
bind to the substrate
adhesive to the substrate
connection to the substrate
relation to the substrate
adhesion to the substrate
connections to the substrate
bonding to the fluorine
bonding to the phosphomonoester
bonding to the glass
bonding to the ether
bonding to the silicon
bonding to the cubane
bonding to the face
bonding to the solvent
bonding to the stability
bonding to the tension
bonding to the sand
bonding to the exocyclic
bonding to the device
bonding to the mother
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