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The effect of bonding parameters on the reliability of thick Al wire bond is investigated.
Critical process bonding parameters are identified and characterized to give the optimal bonding conditions.
Laser power, sealing speed and spot diameter were considered as key bonding parameters.
This paper presents the measures to overcome Cu oxidation, the optimization of bonding parameters and the improvement in capillary design.
Different designs of the indium metallization and lid were tested to improve bond strength while keeping the same bonding parameters.
Shear strength measurements were used to characterize the effects of the bonding parameters on the interface bond strength.
Similar(30)
Wire bond programs consist of three key components: material handling, bonding parameter, and bonding path instructions.
Combining the microstructure of bonding interface with shear strength of different joints, the diffusion bonding parameter for present alloy was: 970 °C/10 MPa/2 h.
A load setting of 0.5 kg with a bonding time of 30 s was used as the bonding parameter.
The last geometric-electronic descriptor is the hydrogen bonding parameter, HB1, which was used to estimate the vapor pressure (Basak et al., 1997; Table S6).
The loop spacing (number of amino acids along the sequence between the 2 cysteines involved in disulphide bonding) parameter would be extremely useful to distinguish between classes with the same cysteine motif but different disulphide connectivity patterns.
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