Sentence examples for bonding interfaces of the from inspiring English sources

Several prior studies have reported formation of small voids between the bonding interfaces of the CuDB that can lead to crack initiation, propagation and thereby delamination of the entire interface.

The failures occurred at the leg attachments or the W monoblocks, rather than the bonding interface of the W monoblocks to the leg attachment.

A leak developed in the test vessel with an niobium interlayer after repeated thermal-shock cycles, which was attributed to an extensive crack network that formed in an interfacial layer of a niobium-rich constituent phase located on the bond interfaces of the niobium interlayer; the test vessel with a titanium interlayer did not develop a leak under the conditions tested.

To study the further bonding reliability of two cap structures with the designed interposer, the thermal processes are implemented to examine the bonding interfaces of thinned Si-cap and thinned Si-polymer cap.

Figure 10 The bonding interfaces of Cu/Sn layer and SU-8 polymer with thermal process investigation.

From the scanning results, when 0.5% VMA is added, the fracture induced by the applied bending loads propagates along the weak bonding face, as the CT image shown in Fig. 10(a), which proves a negative impact of the bonding interface on the mechanical property of the laminated structure.

Combining the microstructure of bonding interface with shear strength of different joints, the diffusion bonding parameter for present alloy was: 970 °C/10 MPa/2 h.

The type of bonding we use, 802.3ad, specifies that the bandwidth of the bonded interface will be the sum of the bandwidth of each child interface, while providing fault-tolerance in case a particular sub interface goes down.

The result indicates that most weld interface is the wavy metallurgical bond interface of the direct transition of Cu/SS but "coronary" vortexes containing metallic oxide exist on both sides of the crest.

(left) The bonding interface of Cu/Sn layer with thermal process investigation and (right) the bonding interface of SU-8 polymer with thermal process investigation.

We also examined the bonding interface regions of the specimens pretreated by poly DMA-MEA).