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The morphological features of Cu nanoparticles, sintered Cu nanoparticle paste, Cu Cu bonding interface, and the fracture surface of bonded joints were observed by a scanning electron microscope (FEI Nova Nano SEM 450).
(left) The bonding interface of Cu/Sn layer with thermal process investigation and (right) the bonding interface of SU-8 polymer with thermal process investigation.
d The Cu Cu bonding interface after isothermal aging at 150 °C for 200 h.
This result again demonstrates that the Cu Cu bonding interface is compact and thermally stable.
The bonding interface has been examined and the bonding mechanism has been proposed.
TC test is based on temperature changes that induce repeated stresses at bonding interface.
c The partially magnified bonding interface after bonding at 300 °C for 60 min.
Besides, the microstructure and element composition of the bonding interface are almost unchanged before and after aging.
The surface forms a biologically active hydroxycarbonate apatite (HCA) layer, which provides the bonding interface with tissues.
Fig. 1 Confocal microscopy showing the bonding interface with adhesive layers (rhodamine-B) and dentin immersed in fluorescein.
Bonding interface properties were evaluated as proposed in section 8.F of DNV RP, with some modifications as described below.
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