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Scanning electron micrograph (SEM) was used to identify the mode of bonding failure.
Conventional approaches give rise to problems such as repetitive bonding failure and loss of anchorage.
It is found that the jackets increase the bond strength and ductile behavior due to the transfer of splitting bonding failure to pull-out bonding failure.
There was nearly no slip between the old and new concrete before the bonding failure of the interface.
Huang et al., Wire Bonding Failure Mechanisms and Simulations of Cu Low-K IMD Chip Packaging, AMC 2002.].
Peak tensile stress exists in the tension zone test points indicates the bonding failure occurs between adhesive and CFRP tendons.
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However, if not, the bond failure in the bonded region governs overall behavior of the beam showing brittle behavior.
The overall bond failure rate was 7.2%.
F2000 air-abraded specimens exhibited adhesive bond failure only, whereas all other groups showed both adhesive and combined bond failures.
Combined cone-bond failure was obtained in all 7 tests.
The typical modes of failure are bar tensile failure, grout-bar bond failure, grout-sleeve bond failure, and sleeve tensile failure.
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