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Under certain bonding conditions, adjacent atoms will form multiple bonds with each other.
The comparison between two film/substrate bonding conditions is made.
The bonding conditions were simulated through the consideration of different spring layer parameters.
Our future studies will investigate superior bonding conditions for the sensor.
Two different bonding conditions are investigated for the joint: undamaged and damaged (with disbond).
Critical process bonding parameters are identified and characterized to give the optimal bonding conditions.
Similar(16)
In this study, we investigated the intermetallic compounds (IMCs) at the bonding interface with respect to the bonding condition, post-bonding room temperature storage and post-bonding heat treatment.
Natural bonding orbital analysis was performed and the bonding condition of the stable isomers was described.
It indicates that the Cu/Sn bonding structure remains intact under the bonding condition of 250°C ~ 280°C.
Bonding can occur with a joint-in-via (JIV) architecture with an optimized bonding condition when the solder is molten.
NPs will firmly bond to the wall once in contact with it, and thus, bonding condition is dominated by diffusive process and independent of shear flow.
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