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In this study, we investigated the intermetallic compounds (IMCs) at the bonding interface with respect to the bonding condition, post-bonding room temperature storage and post-bonding heat treatment.
Natural bonding orbital analysis was performed and the bonding condition of the stable isomers was described.
Bonding can occur with a joint-in-via (JIV) architecture with an optimized bonding condition when the solder is molten.
In asphalt concrete pavement layered system, interlayer bonding condition has significant effect on its behavior and performance.
The constitutive model depicts the strong dependency of interface behavior on bonding condition of the interface, bonded or unbonded.
In the analysis, temperature variation, and uncertainties in the material properties and asphalt bonding condition have been taken into account.
Similar(32)
Under certain bonding conditions, adjacent atoms will form multiple bonds with each other.
The comparison between two film/substrate bonding conditions is made.
Critical process bonding parameters are identified and characterized to give the optimal bonding conditions.
Two different bonding conditions are investigated for the joint: undamaged and damaged (with disbond).
Therefore, two bonding conditions are investigated, namely undamaged and damaged (with disbond).
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