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A hybrid bond technique with mechanical fastening was suggested to improve the reinforcement efficiency.
The hybrid bond technique changes the failure style from normal debonding to tangential slippery and improves the load carrying capacity at a ratio of 31.13%.
Based on the experiments and analyses, a design procedure was put forward for CFRP sheets to strengthen aluminum structural members using hybrid bond technique.
Analytical models report that shear stresses along the CFRP steel interface are noticeably mitigated at geometric discontinuities and the proposed hybrid bond technique can be used for structure-level application.
Other modelling methods such as the empirical valence bond technique can give excellent results for enzyme activation energies [3, 10], and have provided important insights into the basic causes of catalysis.
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Also, both strengthening bond techniques are contemplated in this analysis.
ASIC chips were fabricated with a TSMC 0.25μm CMOS process, and CdTe sensors were bump-bonded to the ASIC chips by a gold-stud bonding technique.
It is recommended to use the wet-bond technique with special adhesives.
The mean tensile strength value for the modified fibres showed an improvement over 7.9% whereas the interfacial shear strength in modified fibre epoxy model composites, as determined by micro-bond technique, improved by 44.68%.
This is a fluxless bonding technique.
This bonding technique consistently achieves uniform and void-free joints.
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