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Microscopic examinations of the fractured joints were performed in order to analyse the overall bond quality.
The interaction effect of main process parameters on bond quality was researched.
The effects of different process and material variables on the bond quality were studied.
Lap shear tests were also performed to evaluate the bond quality at composite-metal interfaces.
Little is known about the effect of dentin pretreatment on the bond quality of self-adhesive resin cements.
The bond quality at the nodes of the cores has been experimentally determined using single-lap shear test.
Similar(15)
A sensor integrated in a smart ultrasonic transducer was used to monitor the bonding quality during wire-bonding process.
These sensors arrays will be used to evaluate the encapsulation characteristics of wafer-level packaging, by revealing the bonding-induced stress distribution as well as bonding quality.
During the assembly phase, prior to the physical mounting of the plaquettes on the disks a thorough electronic test is necessary to check each channel for functionality, noise level, required threshold trimming and bump-bond quality.
The bonding quality was investigated using scanning acoustic microscopy (SAM).
Different modal feature has different sensitivity to the bonding quality.
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