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Therefore, the thickness of the electroplated bond layer must be large enough to provide sufficient micro-bonding force to overcome the single grain micro-cutting force during grinding.
There was approximately 3.5 times larger strain in the compliant bond layer compared to the stiff bond layer.
The stiff bond layer generated 5 times higher tensile stress maxima compared to the compliant bond layer.
Very high stress concentrations of above 5700 MPa tensile stresses were observed in the bond layer just behind the contact zone for the stiffer bond layer.
These aspects affect how the bond layer forms and influence the mechanical properties of the joint.
The bond layer between metal and ceramic usually is a sprayed metallic coating and the thermal barrier reliability is influenced by the behaviour of the substrate bond layer and the bond layer ceramic interfaces.
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Stiff bond layers are not ideal for beam tests, as predicted by the results of the bond characterization tests and delamination theory.
(8) The thinner adhesive layers lower the chances of a concrete-adhesive interface failure; thus, stiff bond layers are not ideal.
Al2O3/ZrO2 multilayer films have been used as bond layers of thermal barrier Coatings, dielectric films, and highly transparent materials in optical and protective coatings[2, 3].
Both compliant low modulus (E=100 GPa) and stiff high modulus (E=500 GPa) bond layers at the coating/substrate interface of 200 and 500 nm thickness were investigated.
For both coatings, metallurgical bond layers with thickness of around 100 μm and notable for their eutectic morphology were obtained.
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