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b EQE spectra of hybrid solar cells with and without SiOx Si bond Table 1 Device performances of hybrid solar cells with and without SiOx Si bond Devices V oc (V) J sc (mA/cm2) FF PCE SiNHS/Ag 0.527 23.6 39.4 4.8 SiOx SiNHS/Ag 0.538 26.1 41.6 5.5.
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Bonded devices presented an S-shaped J-V curve with a kink close to Voc caused by a built-in potential barrier at the III-V//Si interface that reduces the fill factor and therefore the efficiency of the device by 7% compared to the stand-alone GaInP/GaAs tandem cells.
The bonding device and the manufactured testing device are presented along with the first experimental campaign results which validate the test design.
Don't try silly James Bond devices like flame-throwers or slashing blades on the sides of the car: firms that once used to fit them are bankrupt, so maintenance is tricky.Most important, know the risks and take precautions.
Device dimensions were determined with the SEM on the FIB instrument and an AFM (MFP-3D, Asylum Research, Inc .. To bond the devices, the substrates and #1.5 cover glass were hydrolyzed in a solution of 1 M NaOH for 15 min at 70 °C, sonicated in water, brought into contact with each other, dried overnight at 90 °C, and annealed in a furnace at 545 °C for 10 h.
As a result, serious wire deflection during transfer molding process could make adjacent wires short, and this issue becomes more critical as a smaller wire diameter has to be applied for the finer pitch wire bonded IC devices.
This nontoxic, biodegradable, reversible, edible fluid also bonds to device surfaces and is demonstrated to reduce friction and provide striking wear protection.
– Ashwin Seshagiri Talk to Me, Siri On the Media | Brooke Gladstone and Genevieve Bell on Spike Jonze's film, "Her," and our volitional bonds with mobile devices.
BERLIN -- Germany is determined to defend the euro as a political project that glues Europe together, its foreign minister said Thursday, dismissing euro bonds or other devices as a way to shore up the common currency.
His research interests include 3D IC, chip bonding, and electronic devices.
Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
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