Sentence examples for between the solder and from inspiring English sources
These interfacial fractures are often either between layers of dissimilar intermetallic compounds (IMCs), or between the solder and IMC layer.
The role of Ni is difficult to discern but it is most concentrated in the Cu6Sn5 intermetallic phase located at the interface between the solder and the copper substrate.
These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu6Sn5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials.
Microstructure of the interface between the solder and copper substrates in Cu solder Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured.
The Cu/Sn3.0Ag0.5Cu/Cu joints were reflowed at 250 °C and 280 °C for 10 min, respectively, resulting in formations of a thin (6.08 μm) and thick (13.25 μm) intermetallic compound layer between the solder and Cu substrate.
Influence of antimony and copper in Sn Sb Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied.
Intermetallic compounds (IMCs) grow at the interface between the Nb and the solder, after a latency time required for Nb to diffuse in the solder, and these have been identified by X-ray diffraction as NbSn2 hexagonal platelet crystals, with a highly preferred orientation.
It will immediately begin to melt the solder and the solder will drop into the seam.
Apply just enough solder to the heated wire so that melted solder flows back into the insulation, then remove the solder and heat from the wire.
The addition of Na to SnZn causes a reduction in the thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate, and an increase in the activation energy of the Cu5Zn8 phase compared to eutectic SnZn.
Instead, by changing the interfacial energy between the molten solder and the interfacial IMC, the addition of Ag affects the growth orientation and coarsening behavior of interfacial Cu6Sn5 grains.
