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A cohesive element layer has been used between the chip layer and the bulk material to simulate the delamination/peeling effect.
Therefore, a red layer between the chip layer and the machined surface layer could be obviously seen in Fig. 11a.
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Put the other piece of bread on top of the potato chip layer.
The approach surmounted the difficulty of the large size difference between the chip and the ULK layers in computations.
Sprinkle the 1 cup of chopped pecans over top the chocolate chips layer evenly.
In particular, only the mode II contributes to the ERR which increases with the ratio of the chip size to the distance between the chips and with the compliance of the adhesive and substrate layers.
Hidden layers (n) act as intermediate layers between the input vector layer and output layer.
Ff3 has two components: friction between the chips and in situ simulant, and cohesion of the chips.
FP carried out the ChIP-chip analysis, performed the statistical comparisons between the ChIP-chip and expression datasets.
There is a discrepancy between the ChIP-on-chip and ChIP-qPCR analysis for CTCF binding sites.
Chips are made in layers, and the germanium lasers are built into the chip during the layering process.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com