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Furthermore, as the GB free volume increased, the difference in segregation energies between the 1st layer and the 0th layer increased.
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Furthermore, another interfacial layer between the ZrO2 layer and bottom TiN electrode is also visible.
Addition of a Fe TiO2 film between the TiO2 layer and the conductive substrate caused a marked increase in photocurrent.
Twinning deformation occurred in the W2C layer can explain the absence of orientation relationships between the W2C layer and the parent phase WC during solid-phase transformation.
The long-term stability test showed a good integrity between the fTiO2-SiO2 landr and the PVDF substrate after 31-days of GLMC operation.
Similarly, inserting an electron-selective layer between the (CH3NH3 PbI3 layer and the Ag electrode may also suppress the charge recombination at the (CH3NH3 PbI3/Ag interface.
A similar step of 150 nm is observed at the interface between the P2 layer and the silicon; however, the P2-layer thickness appears uniform throughout.
However, an interfacial layer of SiO2, with a thickness of about 2 nm, is also observed between the Al2O3 layer and the Si substrate.
The bond strength recovered at 450 and 500 °C, since intimate bonding was achieved between the CuAl2 layer and the lower layer (Cu4Al3 or CuAl), which was chemically grown between the CuAl2 and Cu9Al4 layers.
To account for this, an interfacial layer thickness of 2.6 to 3.0 nm with a dielectric constant of 6 was incorporated during simulation in between the Al2O3/GaAs layer.
The growth kinetics of W5Si3 layer formed at the interface between the WSi2 layer and the W substrate obeyed a parabolic rate law, indicating the diffusion-controlled growth.
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