Sentence examples for behavior of the printed from inspiring English sources

Finally, the thermal behavior of the printed features formed using the surfactant-free ink is deciphered from the Resistance Temperature data obtained from 6 K to 350 K, where the temperature coefficient of resistivity (TCR) is calculated to be very low (e.g. 1 Ω/K in the range of 6 80 K, or −2.7 × 10−4 ppm/K), comparable to other low TCR materials such as polymer/carbon composites.

The mechanical behavior of these printed IPCs is investigated under uniaxial compression.

Guided by experimental tests and finite element analyses, we systematically study the compressive behavior of the 3D printed auxetics reinforced composites and achieve a significant enhancement of their stiffness and energy absorption.

The viscoelastic stress relaxation behavior of the 3D printed alginate-polyacrylamide IPN hydrogels was influenced most strongly by varying the concentration of the acrylamide cross-linker (MBAA), while the elastic modulus was affected most by varying the concentration of total monomer material.

Furthermore, the 3D printed MR elastomer also exhibits the anisotropic behavior when the direction of the magnetic field is changed with respect to the orientation of the printed filaments.

This paper presents a study of the mechanical behavior of 3D printed structures using cementitious powder.

Influence of printing direction on the anisotropic behavior of 3D printed polymer is investigated by applying the proposed test method to specimens printed in two different directions.

The layer printing sequence in three-dimensional (3D) printing affects the molecular structure of the printed layers, as shown for bottom-up stereolithography printing using an ultraviolet-curable acrylate ester resin.

MTS compression and Split Hopkinson Pressure Bar tests are performed to judge the material behavior of SLM printed 316L stainless steel, and Johnson-Cook constitutive model parameters are fitted from the results.

The test data shows an excellent fit with a tensor based failure criterion that includes interaction strength tensor components, thus being able to capture the strength behavior of SLS printed components under complex loading conditions.

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H2S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology.