Sentence examples for behavior is mainly attributed from inspiring English sources
It was found that the observed behavior is mainly attributed to the hydrogen bonds formed between PU2 and water molecules.
It is found that a upper PS-rich phase layer is formed when Mw,PS<4 k, and this behavior is mainly attributed to the low interfacial tension between PS and PMMA component.
The effect of R ratio on the FCP behavior is mainly attributed to crack closure effects, in which crack faces contact each other with the crack closure stress intensity factor, Kcl lower than the minimum applied stress intensity factor, Kmin (Starke and Williams 1989; Jeong et al. 2015a).
The improved capacitive behavior is mainly attributed to the high electronic conductivity of the RGO/Zn Al LDH nanohybrids, which comes from two sources of intrinsic high conductivity of the graphene sheets and interaction between the RGO and the LDHs in the nanohybrids.
The improved tribological behavior is mainly attributed to the higher porosity with well-dispersed micro-pores facilitating a better water lubrication, as well as the mostly retained mechanical properties of off-angle coatings due to controlled porosity in a certain range.
This behavior is mainly attributed to the presence of residual stresses, unintentional doping, and/or edge effects.
Such behaviors were mainly attributed to the difference in the density of the dangling bonds as well as the backbonds on the silicon surface [12].
The improved mechanical behaviors are mainly attributed to LPSO phase kink-banding strengthening at low temperature and the precipitation strengthening of a large amount of fine (Mg,Zn 3Y particles at high temperature after SHP treatment.
Figure 4a shows the drain current (I d) as a function of the gate voltage (V g), for the 90-nm-thick SnSe nanoflake, for the source-drain voltages (V ds) of −30, 0, and 30 V, at room temperature, indicating a clear p-type semiconductor behavior, which is mainly attributed to the Sn vacancies, as reported previously [15, 16, 22, 24, 35 39].
However, the effect of heat treatment on damping behavior of 2D and 3D C/SiC composites is mainly attributed to the change in the SiC matrix and interphase bonding, and it is dependent on fiber preform architecture.
The difference in the deposition behavior is related to the difference in the rest potential of PS that is mainly attributed to the solution chemistry of copper ions in these solutions.
