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a Before thermal cleaning process.
Fig. 1 Transmission electron microscopy (TEM) images of poly-3-hexylthiophene (P3HT):6,6-phenyl-C61-butyric 6,6-phenyl-C61-butyric 6,6-phenyl-C61-butyric 6,6-phenyl-C61-butyricng acid50 °C for 30 methylnd c aftesternealing at 150 °C for 2 h.
(a) The nanopore before thermal process.
(a) Reflections of the Si (111) before thermal cleaning.
Before thermal annealing, the resistivity of Mg-doped GaN films was ∼1 × 106ohm·cm.
The lower mechanical properties may be attributed to insufficient mixing and initial curing before thermal treatment.
The TiO2 NP photoanode thin film was fabricated by mechanical compression before thermal treatment.
All the samples were dried in desiccators for 24 h before thermal analysis.
After subsequent cooling to 20°C, spectra were identical to the ones taken before thermal denaturation.
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Cross-sections of the membranes were examined before and after thermal cycling by scanning electron microscope.
Temperature of concrete before the thermal treatment.
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