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In order to optimise multiple layer coatings combining the load supporting capabilities of TiN/TiCN ceramic films with the low friction and wear resistance of an amorphous Me-C H, single-layer hydrogenated titaniuMe-C H,itride thin films (Ti–C–N:H) have been deposited using a hydrogenatedtitaniumttering/plasma-enhancabonitridel vapour deposithin system.
Diamond thin films have been deposited using a modified hot filament CVD method involving a dual-plasma reactor arrangement.
DLC thin films have been deposited using a combined DC and high power impulse vacuum-arc process.
Highly conducting and transparent gallium doped zinc oxide (ZnO Ga) layers have been deposited using a spray pyrolysis process.
A range of CrCu (N) compositions have been deposited using a twin-target (Cr and Cu) unbalanced magnetron sputtering system.
Thick nitrides (ZrN, CrN and TiN) and carbonitrides (ZrSiCN and TiSiCN) have been deposited using a Plasma Enhanced Magnetron Sputtering (PEMS) technique.
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PVD TiN, TiCN and TiC thin films were deposited using a filtered arc deposition system.
ZnO structures were deposited using a simple chemical bath deposition technique onto interdigitated electrodes fabricated by a conventional photolithography method on SiO2/Si substrates.
CrN coatings were deposited using a hybrid physical vapor deposition (PVD) and metal-plasma ion implantation (MPII) technique.
Diaflex is deposited using a technique called physical vapor deposition (PVD) on the standard 316 L stainless steel diaphragm.
The surface of these devices was passivated with a 200-nm silicon nitride layer, which was deposited using a plasma-enhanced chemical vapor deposition technique.
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