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Atomic layer deposition (ALD) is a novel thin film deposition technique based on sequential self-limited and complementary surface chemisorption reactions using precursor vapor.
Atomic layer deposition (ALD) is a new type of thin film deposition technology based on sequential self-limited and complementary surface chemisorptions reactions using precursor vapor with simple and precision thickness control, large area uniformity, and excellent three-dimensional conformality, especially for deposition of nano-laminated structure [18, 19].
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It is a thin film growth method based on sequential, self-limiting surface reactions that can deposit conformal thin films with excellent conformal step coverage and is ideal for the deposition on complex non-planar surface topography [22, 23].
So far, the only effective approach growing high-quality thin films is the atomic layer deposition (ALD) technique based on sequential self-terminating gas-solid reactions [7].
Atomic layer deposition (ALD) is a technology based on sequential self-saturated surface treatment and reactions, which lead to the controlled cycle-by-cycle period growth of very thin films.
Atomic layer deposition (ALD) is a kind of novel thin film deposition technique based on unique sequential self-limited surface chemisorptions reactions [20, 21].
The development of an ALD process, which is based on the sequential self-limiting surface reactions from generally two gaseous precursors, requires knowledge of the reactions mechanisms.
PF is a sequential Monte Carlo methodology based on sequential importance sampling (SIS).
It uses Matlab software based on sequential running time.
Most of the solutions are based on sequential methods that make inference according to current information.
The GB conversion method is based on sequential Bayesian tracking, using a GB formulation.
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