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As a result, the SiO2 micropillars appear protruding out of the backside of the silicon wafer (D in Figure 1).
In addition, the backside of the silicon was etched by a KOH etchant to generate thermally insulated heater membranes.
Modeling was performed in transmission at a wavelength of λ = 1,565 nm and assumed no reflection from the backside of the silicon wafer.
The process was performed by dropping the etchant on the array to prevent etching on the backside of the silicon wafer.
Gold contacts were deposited with an area of 4.5 × 10-4 cm2, aluminuminum was deposited onto the backside of the silicon substrate.
Aluminium 99.99% was evaporated as a backside contact of the Si wafer to improve the distribution of the current density in the anodization stage and to achieve an ohmic contact on the backside of the silicon substrate.
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Another feature of the MEP-i SSD is that the electrodes on the backside (p-side) of the silicon are divided into 16 strips to reduce the surface area.
The sensor elements are fabricated as meso-PSi (pore sizes <50 nm, pore thickness ∼7 μm), with Ag metallic contacts made exclusively at the backside of bulk silicon, and ethanol sensing is achieved by measurement of the real-time capacitance and conductance.
Texturing of both the front side and the backside of silicon solar cells has been used in the past to increase the absorption of infrared sun light energy in silicon solar cells.
In the present study, symmetry of the structure is achieved by shifting the center of mass of the proof mass toward the beam plane by selectively electroplating a 20 μm thick gold layer atop the proof mass and simultaneously reducing the silicon thickness from backside of the proof mass surface.
Platinum-silicide is formed on the boron heavily doped backside of p-type silicon wafers for ohmic contact for the accuracy of the measurements.
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