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This module concept also envisages Inter-Chip-Vias (ICV) to extract the signals from the backside of the chips, thereby achieving a higher fraction of active area with respect to the present pixel module design.
To facilitate the flow-through process, silica (30 nm), which is hydrophilic, was deposited on the backside of the chips using electron-beam evaporation.
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The measured gain center frequency is shifted about 300 MHz towards higher frequencies after thinning because of the image mirror currents within the conducting material at the backside of the chip.
Figure 3b shows that at a cutting length of 30 nm, there is considerable chip formed ahead of cutting tool, and the backside of the chip is straight due to the tight contact of formed chip with cutting tool rake face.
To minimise contact resistance, the metal backside contacts of the chips were electroless plated with gold.
Here we present a novel liquid-cooling concept, for targeted, energy efficient cooling of hotspots through passively optimized microchannel structures etched into the backside of a chip (embedded liquid cooling or ELC architecture).
Drill two holes on the backside of the board using a countersink drill bit.
On a whim, I went down the backside of the hill.
The light was achieved irradiated to the backside of the electrodes (FTO side, backside illumination).
The Backside Of The EVGA GeForce GTX 1660 Ti XC Black.
Most of the backside of the case is brushed metal.
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